In the electronic industry, from the cleaning of various electronic components to the preparation of a series of process solutions, high-quality pure water is needed, especially in the production of semiconductor devices and large-scale integrated circuits. Almost every process needs to be cleaned with ultrapure water. Ultra pure water plays an increasingly important role in the electronic industry, and has become one of the important factors affecting the quality and production cost of electronic components. Polishing resin (mixed bed resin) is an essential ion exchange resin for the preparation of ultra pure water.

When the integration of integrated circuit products reaches 1M, the resistivity of pure water is required to reach 18 M Ω· When the integration degree of integrated circuit products reaches 16M, the resistivity of pure water is required to reach 18.2m Ω· It has reached the theoretical value of ultrapure water.

Ultra pure water for electronic industry is prepared by multi-stage reverse osmosis and two-stage mixed bed treatment, as well as ultraviolet sterilization and ultrafiltration. The biggest characteristic of reverse osmosis technology is the high removal rate of ions in water, which can remove ions in water to a lower level, but it can not completely remove them. At this time, ion exchange resin will play an irreplaceable role. Ion exchange resin is suitable for the treatment of water with low ion content. It can completely remove the ions in water, especially for the polishing stage of ultra pure water. This is one of the reasons why ion exchange resin has strong vitality.

Conventional mixed bed resins can be used in grade I mixed bed prepared by ultra pure water in electronic industry, while electronic grade resin is needed in grade II refined mixed bed. The polishing resin should not only have strong exchange capacity and high mechanical strength, but also have high regeneration purity and uniform particle size distribution. Among them, the H-type ratio of cation exchange resin must be above 99.0%, and the iron content should be below 50.0ppm dry resin; The OH type rate of anion exchange resin must be more than 95.0%, and the content of chloride ion must be less than 0.50%. The H-type rate of cation exchange resin used for ultra pure water polishing must be more than 99.9%.